polymer_dielectric_constant_155

This is a polymer-based dielectric material formulated to achieve a relative dielectric constant of approximately 1.55, positioning it in the mid-range of polymer dielectrics—higher than most unfilled polymers but lower than ceramic-filled composites. Typical applications include electrical insulation, printed circuit board substrates, capacitor films, and high-frequency signal transmission components where modest dielectric constant combined with polymer processability and cost-effectiveness is advantageous. Engineers select this material class when they need a balance between electrical performance, mechanical flexibility, and manufacturing ease that pure polymers cannot achieve alone, or when ceramic fillers would introduce brittleness or processing constraints.