polymer_dielectric_constant_155

polymer

This is a polymer-based dielectric material formulated to achieve a relative dielectric constant of approximately 1.55, positioning it in the mid-range of polymer dielectrics—higher than most unfilled polymers but lower than ceramic-filled composites. Typical applications include electrical insulation, printed circuit board substrates, capacitor films, and high-frequency signal transmission components where modest dielectric constant combined with polymer processability and cost-effectiveness is advantageous. Engineers select this material class when they need a balance between electrical performance, mechanical flexibility, and manufacturing ease that pure polymers cannot achieve alone, or when ceramic fillers would introduce brittleness or processing constraints.

PCB substrates and laminatescapacitor dielectricsRF/microwave circuit boardsflexible electronics and filmselectrical insulation systemshigh-frequency signal transmission

Compliance & Regulations

?UL 94?Conflict Free?RoHS?REACH?TSCA?Prop 65
Units:
siimperial
PropertyValueUnitConditionsSource
Dielectric Constant (Relative Permittivity)(εr)
—
median of 2 measurements
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Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Safety & Biocompatibility

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.