Cu1 Ni1 Sb2

semiconductor

· Cu1 Ni1 Sb2

Cu1Ni1Sb2 is an intermetallic semiconductor compound combining copper, nickel, and antimony in a defined stoichiometric ratio. This material belongs to the family of half-Heusler or similar ternary intermetallic semiconductors, which are primarily of research and development interest rather than established commercial use. The compound is investigated for potential applications in thermoelectric devices, optoelectronics, and solid-state energy conversion due to the electronic and thermal properties typical of ternary metal-antimony systems.

thermoelectric devicessemiconductor researchenergy conversion (experimental)intermetallic compoundsoptoelectronic materials (emerging)

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	90.82	GPa	—
Shear Modulus(G)	37.17	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.00640	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.1200	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Cu1 Ni1 Sb2

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control