Cu1Ni1Sb2 is an intermetallic semiconductor compound combining copper, nickel, and antimony in a defined stoichiometric ratio. This material belongs to the family of half-Heusler or similar ternary intermetallic semiconductors, which are primarily of research and development interest rather than established commercial use. The compound is investigated for potential applications in thermoelectric devices, optoelectronics, and solid-state energy conversion due to the electronic and thermal properties typical of ternary metal-antimony systems.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 13,172.6 | ksi | — | ||
Shear Modulus(G) | 5,391.5 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00640 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1200 | eV/atom | — |