Copper beryllium is a precipitation-hardenable copper alloy (typically 2% beryllium by weight) offering exceptional strength-to-weight ratio, high electrical and thermal conductivity, and excellent fatigue resistance, used primarily in aerospace, defense, and high-reliability electronics applications. The H-series tempers (H01, H02, H04) represent increasing levels of cold work hardening for enhanced strength, while TF00 is the annealed condition providing maximum ductility and machinability.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Poisson's Ratio(ν) | 0.2700 | - | 22°C | ||
Shear Modulus(G) | 7,300 | ksi | 22°C · Strip | ||
Young's Modulus(E) | 18,500 | ksi | 22°C · Strip |
3 interactive curves for this material
Stress-strain, S-N fatigue and environmental knockdown curves are free with an account.
Create free account| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
CTE vs Temperature(α(T)) | Curve (19 pts) | µin/in·°F | — | ||
Specific Heat vs Temperature(Cp(T)) | Curve (19 pts) | BTU/(lb·°F) | — | ||
Thermal Conductivity vs Temperature(k(T)) | Curve (20 pts) | BTU/(hr·ft·°F) | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2980 | lb/in³ | 22°C |