Copper-beryllium alloy in H01 (hard/strain-hardened) condition, a precipitation-hardenable copper alloy containing 1.6-2.0% beryllium used in aerospace and defense applications requiring high strength-to-weight ratio, excellent electrical and thermal conductivity, and non-magnetic properties. The H01 temper provides maximum strength through strain hardening with controlled elongation, suitable for demanding applications including springs, connectors, and precision components operating at elevated temperatures.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Elongation at Break(εf) | 2.500 | - | 22°C · Strip · TH01 · ASTM B194 · L · t=≤0.188 in | ||
Poisson's Ratio(ν) | 0.2700 | - | 22°C | ||
Shear Modulus(G) | 50.33 | GPa | 22°C · Strip | ||
Ultimate Tensile Strength(σUTS) | 1.207 | GPa | 22°C · Strip · TH01 · ASTM B194 · L · t=≤0.188 in | ||
Yield Strength (0.2% offset)(σy) | 1.034 | GPa | 22°C · Strip · TH01 · ASTM B194 · L · t=≤0.188 in | ||
Young's Modulus(E) | 127.6 | GPa | 22°C · Strip |
3 interactive curves for this material
Stress-strain, S-N fatigue and environmental knockdown curves are free with an account.
Create free account| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
CTE vs Temperature(α(T)) | Curve (19 pts) | 1/K | — | ||
Specific Heat vs Temperature(Cp(T)) | Curve (19 pts) | J/(kg·K) | — | ||
Thermal Conductivity vs Temperature(k(T)) | Curve (20 pts) | W/(m·K) | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 8.249 | kg/m³ | 22°C |