Al₁Cu₂Hf₁ is an intermetallic compound combining aluminum, copper, and hafnium—a research-phase material exploring the property space between lightweight aluminum alloys and refractory intermetallics. This composition targets enhanced strength and thermal stability by leveraging hafnium's high melting point and chemical affinity within a copper-rich matrix, making it primarily of academic and developmental interest rather than established industrial production. Potential applications lie in high-temperature aerospace structures, thermal barrier systems, or advanced composites where the material family's strength-to-weight ratio and oxidation resistance could compete against titanium aluminides or conventional superalloys, though maturity and cost-effectiveness remain open engineering questions.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 135.0 | GPa | — | ||
Shear Modulus(G) | 50.78 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00490 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.3370 | eV/atom | — |