Al1 Cu2 Hf1

semiconductor
· Al1 Cu2 Hf1

Al₁Cu₂Hf₁ is an intermetallic compound combining aluminum, copper, and hafnium—a research-phase material exploring the property space between lightweight aluminum alloys and refractory intermetallics. This composition targets enhanced strength and thermal stability by leveraging hafnium's high melting point and chemical affinity within a copper-rich matrix, making it primarily of academic and developmental interest rather than established industrial production. Potential applications lie in high-temperature aerospace structures, thermal barrier systems, or advanced composites where the material family's strength-to-weight ratio and oxidation resistance could compete against titanium aluminides or conventional superalloys, though maturity and cost-effectiveness remain open engineering questions.

high-temperature aerospace components (research stage)refractory intermetallic developmentthermal barrier coatings (exploratory)advanced structural compositesmaterials science researchelevated-temperature alloy systems

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
PropertyValueUnitConditionsSource
Bulk Modulus(K)
ksi
Shear Modulus(G)
ksi
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
eV
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Formation Energy(ΔHf)
eV/atom
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.