ZnCuPd2 is a ternary intermetallic compound combining zinc, copper, and palladium, belonging to the family of precious-metal-containing alloys and intermetallics. This material is primarily of research interest rather than a widely commercialized engineering alloy, with potential applications in catalysis, electronic contacts, and high-performance bonding applications where palladium's chemical stability and copper's conductivity can be leveraged. Engineers would consider this material in specialized contexts where the unique properties of the ternary system—such as corrosion resistance, thermal stability, or catalytic activity—offer advantages over conventional binary copper-palladium or copper-zinc alternatives.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 10.15 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00500 range 0.000–0.01000median of 2 measurements | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | 0.6700 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.3924 | eV/atom | — |