YCuSn is an intermetallic compound combining yttrium, copper, and tin, representing a specialized alloy system studied primarily in materials research rather than established industrial production. This material belongs to the rare-earth intermetallic family and is of interest for its potential mechanical properties and thermal stability, though it remains largely experimental. Applications are being explored in specialized thermal management, electronic packaging, and high-performance structural applications where the combination of rare-earth strengthening and copper-tin metallurgical heritage offers potential advantages over conventional brasses or copper alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)3 entries | 75.82 | GPa | — | ||
| ↳ | 75.82 | GPa | — | ||
| ↳ | 80.36 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.1561 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν)2 entries | 0.2216 | - | — | ||
| ↳ | 0.2300 | - | — | ||
Shear Modulus(G)3 entries | 51.84 | GPa | — | ||
| ↳ | 51.84 | GPa | — | ||
| ↳ | 52.77 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 6.920 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -28.24 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.6513 | eV/atom | — |