WF6

metal
· JVASP-32438· WF6

WF6 (tungsten hexafluoride) is a volatile tungsten compound used primarily as a precursor in chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes. It is essential in the semiconductor and microelectronics industries for depositing tungsten thin films on integrated circuits, where it enables precise metallization of interconnects and contacts at the nanoscale. WF6 is valued over alternative tungsten sources because of its high volatility, excellent film conformality, and compatibility with modern semiconductor manufacturing—making it the preferred choice for advanced device fabrication where traditional sputtering or other deposition methods cannot achieve the required coverage uniformity in high-aspect-ratio features.

semiconductor metallizationintegrated circuit interconnectschemical vapor deposition (CVD)atomic layer deposition (ALD)microelectronics manufacturingthin-film coating precursor

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
PropertyValueUnitConditionsSource
Density(ρ)
0.1780
lb/in³
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
0.8280
eV
Magnetic Moment(μB)
0.000
µB
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Energy Above Hull(ΔEhull)
0.000
eV/atom
Formation Energy(ΔHf)
-2.663
eV/atom
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.