TmNiSn is an intermetallic compound composed of thulium, nickel, and tin, belonging to the half-Heusler alloy family—a class of materials attracting significant research attention for thermoelectric and magnetic applications. This compound is primarily investigated in academic and laboratory settings rather than established industrial production; its potential lies in thermoelectric energy conversion (waste heat recovery), magnetic refrigeration, and semiconductor applications where the intermetallic structure offers favorable electronic band structure and phonon scattering properties. Engineers considering TmNiSn should recognize it as an emerging material in the research phase, selected for its promise in energy efficiency and thermal management applications where conventional metals and semiconductors have performance limitations.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 9.752 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.6909 | eV/atom | — |