TiSiPd is an intermetallic compound combining titanium, silicon, and palladium, belonging to the family of advanced metallic composites designed for high-performance structural and functional applications. This material is primarily of research and developmental interest, explored for aerospace, automotive, and high-temperature engineering contexts where the combination of titanium's lightweight properties, silicon's hardness, and palladium's chemical stability and wear resistance offer potential advantages. The ternary composition targets applications requiring a balance of mechanical strength, thermal stability, and corrosion resistance that cannot be easily achieved with conventional binary alloys or simple titanium alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 145.8 | GPa | — | ||
Poisson's Ratio(ν) | 0.3300 | - | — | ||
Shear Modulus(G) | 59.88 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 5.958 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.8370 | eV | — | ||
Dielectric Constant (Relative Permittivity)(εr)2 entries | 27.07 | - | — | ||
| ↳ | 22.89 range 20.50–25.28median of 2 measurements | - | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Piezoelectric Modulus(eij) | 0.2100 | C/m² | — | ||
Seebeck Coefficient(S) | -352.8 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.1664 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.6184 | eV/atom | — |