TiNiSn is a ternary intermetallic compound combining titanium, nickel, and tin, belonging to the class of advanced metallic materials and shape-memory or high-temperature alloy families. This material is primarily of research and developmental interest, with potential applications in thermoelectric devices, high-temperature structural components, and precision actuation systems where the combination of metallic bonding and intermetallic ordering provides specific mechanical and thermal characteristics. Engineers would consider TiNiSn where conventional binary alloys (such as TiNi or NiTi) fall short in performance, particularly when operating environments demand tailored thermal conductivity, stiffness, or shape-recovery behavior combined with tin's contribution to phase stability or cost optimization.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 14,151.3 | ksi | DFT · OptB88vdW | ||
Poisson's Ratio(ν) | 0.2800 | - | DFT · OptB88vdW | ||
Shear Modulus(G) | -3,083.5 | ksi | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Thermal Conductivity(k)2 entries | 3.511 | BTU/(hr·ft·°F) | Measured · 27°C | ||
| ↳ | 3.511 | BTU/(hr·ft·°F) | Measured |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2354 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.4630 | eV | DFT · OptB88vdW | ||
Dielectric Constant (Relative Permittivity)(εr) | 26.90 range 23.51–30.28median of 2 measurements | - | DFT · PBEsol | ||
High-Frequency Dielectric Constant (ε∞)(ε∞) | 26.82 | - | DFT · OptB88vdW | ||
Electron Effective Mass(m*e) | 0.2000 | me | DFT · OptB88vdW · 27°C | ||
Hole Effective Mass(m*h) | 0.2200 | me | DFT · OptB88vdW · 27°C | ||
Electrical Conductivity(σ) | 31.83 | S/cm | Measured · 27°C | ||
Electrical Resistivity(ρe) | 0.000314 | Ω·m | Measured · 27°C | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW | ||
Thermoelectric Power Factor(PF)3 entries | 0.000234 | W/(m·K²) | Measured · 27°C | ||
| ↳ | 0.00240 | W/(m·K²) | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 0.00254 | W/(m·K²) | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Seebeck Coefficient(S)3 entries | -271.3 | μV/K | Measured · 27°C | ||
| ↳ | -283.1 | μV/K | DFT · OptB88vdW · n-type · 1e20 cm⁻³ · 327°C | ||
| ↳ | 367.7 | μV/K | DFT · OptB88vdW · p-type · 1e20 cm⁻³ · 327°C | ||
Thermoelectric Figure of Merit(zT) | 0.01157 | - | Measured · 27°C |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.6595 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf)2 entries | 0.1124 | eV/atom | DFT · OptB88vdW | ||
| ↳ | -0.5452 | eV/atom | Measured |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data