TiInAu is a ternary intermetallic compound combining titanium, indium, and gold, representing an exploratory alloy system rather than a well-established engineering material. This composition falls within research-phase metallurgy, where the gold and indium additions to titanium are being investigated for potential improvements in specific properties such as damping, electrical conductivity, or thermal characteristics. The material is not yet established in mainstream industrial production, but similar titanium-based ternary systems are of interest in aerospace, electronics packaging, and biomedical device development where designers seek enhanced performance beyond conventional binary titanium alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 14,271.7 | ksi | — | ||
Poisson's Ratio(ν) | 0.3500 | - | — | ||
Shear Modulus(G) | -1,786.9 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3414 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.4610 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.2781 | eV/atom | — |