TiCuSiAs is a quaternary intermetallic compound combining titanium, copper, silicon, and arsenic. This is a research-phase material belonging to the family of complex metal intermetallics; it is not a widely commercialized engineering alloy. Interest in such titanium-based multicomponent compounds centers on tailoring specific properties like hardness, thermal stability, or electrical behavior for specialized applications where conventional binary or ternary alloys fall short.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2152 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.04230 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | -0.4276 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data