TiCuSi is a titanium-copper-silicon ternary intermetallic alloy that combines the lightweight and corrosion resistance of titanium with the thermal and electrical conductivity contributions of copper and silicon. This material family is primarily of research and development interest, investigated for potential applications requiring a balance of structural efficiency and functional properties that single-phase titanium alloys cannot provide. Engineers would consider it where simultaneous demands for reduced weight, enhanced thermal management, and corrosion resistance are critical, though it remains less established in production than binary Ti alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 21,522.6 | ksi | — | ||
Shear Modulus(G) | 11,137.9 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.1994 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Seebeck Coefficient(S) | 16.04 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.4843 | eV/atom | — |