TiCu4 is a titanium-copper binary alloy combining titanium's lightweight strength and corrosion resistance with copper's thermal and electrical conductivity. This material family is explored primarily in research and specialized aerospace, biomedical, and thermal management applications where the synergy of titanium's biocompatibility and mechanical properties with copper's enhanced heat transfer or electrical performance offers advantages over single-phase titanium or conventional copper alloys.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.2857 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.01150 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.09692 | eV/atom | — |