Ti6Si2B1 is a titanium-based intermetallic compound belonging to the titanium silicide family, combining titanium with silicon and boron to create a ceramic-like semiconductor material. This compound is primarily of research and developmental interest for high-temperature structural applications, particularly where excellent stiffness and thermal stability are required, though it remains less commercially established than conventional titanium alloys. Its potential applications target aerospace and energy sectors where advanced intermetallic compounds could replace heavier superalloys in extreme thermal environments.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 21,568.7 | ksi | — | ||
Shear Modulus(G) | 14,110.3 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.02470 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.6210 | eV/atom | — |