Ti5CuSn3 is a titanium-based intermetallic compound containing copper and tin as primary alloying elements, belonging to the family of titanium aluminides and intermetallics. This material is primarily of research and development interest, explored for high-temperature applications where lightweight performance and thermal stability are critical; titanium-copper-tin systems are investigated for potential use in aerospace and automotive components where conventional titanium alloys reach their temperature limits. The copper and tin additions aim to improve specific strength and creep resistance compared to unalloyed or conventionally alloyed titanium, though commercial adoption remains limited pending validation of processability and cost-effectiveness.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 6.798 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.3498 | eV/atom | — |