Ti4 Si4 Ni4
semiconductorTi4Si4Ni4 is an intermetallic compound combining titanium, silicon, and nickel in equal atomic proportions, representing a research-stage material rather than a commercial alloy. This compound belongs to the family of ternary intermetallics, which are being explored for applications requiring combinations of high stiffness, thermal stability, and wear resistance; such materials are primarily studied in aerospace and advanced manufacturing contexts where traditional superalloys or titanium alloys may have limitations. The material's potential lies in high-temperature structural applications and specialized wear-resistant coatings, though further development work is needed to establish manufacturing pathways and qualify it for production use.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 168.9 | GPa | — | ||
Shear Modulus(G) | 99.08 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01080 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.7890 | eV/atom | — |