Ti3 Sn1

semiconductor

· Ti3 Sn1

Ti3Sn1 is an intermetallic compound belonging to the titanium-tin system, representing a specific stoichiometric phase in the Ti-Sn binary alloy family. This material is primarily of research and developmental interest rather than a mature commercial product, studied for potential structural and electronic applications where the unique atomic ordering of intermetallics can provide advantageous combinations of stiffness, thermal stability, and electronic properties. Titanium-tin intermetallics are explored as candidates for high-temperature aerospace structures, electronic device components, and wear-resistant coatings, where their ordered crystal structure offers potential benefits over conventional solid-solution alloys.

aerospace structural researchhigh-temperature intermetallic compoundselectronic device substrateswear-resistant coatingsmaterials research and development

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	16,814.7	ksi	—
Shear Modulus(G)	3,858	ksi	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.00710	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.1730	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ti3 Sn1

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control