Ti₃In₁N₁ is an intermetallic nitride compound combining titanium and indium in a ceramic semiconductor phase. This material belongs to the family of transition metal nitrides and represents research-stage development rather than a widely commercialized product; such compounds are investigated for their potential in hard coatings, electronic devices, and thermal management applications where the combined properties of titanium's strength and indium's electronic characteristics may offer advantages over conventional alternatives.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 22,355.1 | ksi | — | ||
Shear Modulus(G) | 4,345.3 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.02530 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.9240 | eV/atom | — |