Ti3 Cu4

semiconductor

· Ti3 Cu4

Ti3Cu4 is an intermetallic compound composed of titanium and copper, representing a research-phase material within the titanium-copper binary system. This compound is primarily of academic and exploratory interest rather than established industrial use, with potential applications in high-temperature structural applications or electronic device components where the unique properties of titanium-copper intermetallics might offer advantages over conventional alloys or pure metals.

experimental intermetallic compoundshigh-temperature applicationssemiconductor researchphase diagram studiescomposite reinforcement potentialmaterial research and development

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.02630	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.1390	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ti3 Cu4

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control