Ti3 Au1

semiconductor
· Ti3 Au1

Ti3Au1 is an intermetallic compound combining titanium and gold in a 3:1 atomic ratio, representing an experimental advanced material in the titanium-gold binary system. This semiconductor intermetallic is primarily investigated in research contexts for its potential in high-temperature applications and specialized electronic devices, where the combination of titanium's strength and gold's thermal/electrical properties could offer advantages over conventional titanium alloys or pure gold compounds. Its intermetallic structure suggests potential applications in aerospace thermal management, specialized electronic contacts, or biomedical devices, though commercial deployment remains limited and material selection would require careful evaluation against more established alternatives in these sectors.

high-temperature aerospace componentselectronic contact materialsresearch/experimental intermetallicsbiomedical device coatingsthermal management systemssemiconductor device fabrication

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65
Units:
siimperial
PropertyValueUnitConditionsSource
Bulk Modulus(K)
—
Pa——
Shear Modulus(G)
—
Pa——
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Band Gap(Eg)
—
eV——
Verified Unverified Low confidence (<80%) Link to source
PropertyValueUnitConditionsSource
Formation Energy(ΔHf)
—
eV/atom——
Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.