Ti3Al1 is an intermetallic compound based on titanium and aluminum, belonging to the family of titanium aluminides that exhibit semiconductor properties. This material is primarily of research and developmental interest rather than established industrial production, representing efforts to create advanced materials with potential applications in high-temperature structural and electronic contexts. Titanium aluminides in general are explored for their combination of low density and potential high-temperature strength, though Ti3Al1 specifically requires further characterization for practical engineering adoption compared to conventional titanium alloys or established semiconductors.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 111.2 | GPa | — | ||
Shear Modulus(G) | 29.54 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.03450 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1500 | eV/atom | — |