Ti3 Ag1

semiconductor

· Ti3 Ag1

Ti3Ag1 is an intermetallic compound in the titanium-silver system, representing a research-phase material that combines titanium's strength and biocompatibility with silver's antimicrobial properties. This material falls within the broader class of binary intermetallics being investigated for medical and aerospace applications where both structural performance and functional (antimicrobial or catalytic) properties are desired. While not yet widely deployed in mainstream engineering, Ti-Ag compounds are of interest in biomedical research as potential alternatives to conventional Ti alloys, leveraging silver's well-known antimicrobial character to reduce infection risk in implant applications.

biomedical implants (research phase)antimicrobial coatingsintermetallic compound developmentdental and orthopedic researchaerospace structural components (exploratory)corrosion-resistant applications

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	117.9	GPa	—
Shear Modulus(G)	23.96	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.04210	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	0.08700	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ti3 Ag1

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control