Ti2CuS4 is an intermetallic compound combining titanium, copper, and sulfur, representing an emerging material within the ternary metal-chalcogenide family. This compound is primarily of research interest rather than established industrial use, being investigated for its potential in thermoelectric applications, energy conversion devices, and advanced functional materials where the combination of metallic and chalcogenide properties offers tunable electronic and thermal characteristics. Engineers evaluating this material should note it remains in the experimental stage; its selection would be driven by specific requirements for phase stability, electrical conductivity, or thermal performance in niche applications rather than as a replacement for conventional structural or functional materials.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 96.57 | GPa | — | ||
Poisson's Ratio(ν) | 0.3300 | - | — | ||
Shear Modulus(G) | 36.94 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 3.851 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg)2 entries | 0.000 | eV | — | ||
| ↳ | 0.000 | eV | — | ||
Magnetic Moment(μB) | 1.918 | µB | — | ||
Seebeck Coefficient(S) | -19.54 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.02280 | eV/atom | — | ||
Formation Energy(ΔHf) | -1.256 | eV/atom | — |