Ti2Pd1 is an intermetallic compound combining titanium and palladium in a 2:1 ratio, belonging to the semiconductor class of materials. This experimental compound represents research into titanium-palladium systems for applications requiring combined thermal stability, electrical properties, and mechanical strength beyond conventional alloys. While not yet established in mainstream industrial production, intermetallics in this family are being investigated for high-temperature electronics, advanced catalytic applications, and specialized aerospace components where conventional titanium alloys or pure palladium prove insufficient.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 21,146.5 | ksi | — | ||
Shear Modulus(G) | 9,230.2 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000400 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.4540 | eV/atom | — |