Ti2Mn1Sn1 is an experimental intermetallic compound combining titanium, manganese, and tin—a ternary system that bridges the families of titanium alloys and tin-based intermetallics. This material is primarily of research interest in materials science, where it is being explored for potential semiconductor or electronic applications that leverage the electronic properties of the Heusler-like phase family to which it may belong. Engineers and researchers would evaluate this compound when seeking alternatives to conventional titanium alloys or rare-earth-dependent semiconductors, though industrial deployment remains limited pending validation of manufacturability, reliability, and cost-effectiveness.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 144.1 | GPa | — | ||
Shear Modulus(G) | 11.96 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.04660 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.07300 | eV/atom | — |