Ti2Al1Tc1 is an experimental intermetallic compound combining titanium, aluminum, and technetium in a 2:1:1 stoichiometric ratio, classified as a semiconductor material. This compound belongs to the family of advanced intermetallics and represents a research-phase material with potential applications in high-temperature electronics and radiation-resistant semiconductor devices. The incorporation of technetium, a rare synthetic element, suggests this material is primarily of academic and specialized defense/nuclear research interest rather than conventional industrial production.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 161.6 | GPa | — | ||
Shear Modulus(G) | 53.30 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.01420 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.4500 | eV/atom | — |