Ti1 Zn3

semiconductor

· Ti1 Zn3

Ti₁Zn₃ is an intermetallic compound combining titanium and zinc in a 1:3 stoichiometric ratio, classified as a semiconductor material. This compound belongs to the titanium-zinc system and represents an experimental or specialized research material rather than a mature industrial standard. The Ti-Zn intermetallic family is investigated for potential applications in aerospace coatings, biomedical implants (leveraging zinc's biocompatibility), and electronic device applications where the semiconductor character and moderate mechanical stiffness offer design advantages over pure metals or conventional alloys.

aerospace coatings and protective layersbiomedical implant researchsemiconductor device developmentthin film applicationscorrosion barriers

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	100.0	GPa	—
Shear Modulus(G)	50.42	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.02600	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.2010	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ti1 Zn3

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control