Ti1Si1Os2 is an experimental intermetallic compound combining titanium, silicon, and osmium—a research-stage material in the refractory metals family. While not yet commercially established, this composition represents exploration into high-performance ceramic-metallic hybrids with potential for extreme-environment applications where thermal stability and mechanical resilience are critical. The inclusion of osmium suggests investigation into materials for aerospace, high-temperature electronics, or wear-resistant coatings, though practical engineering use remains limited to specialized research and development contexts.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 39,518 | ksi | — | ||
Shear Modulus(G) | 18,854.9 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.08170 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.5850 | eV/atom | — |