Ti1 Si1 Os2

semiconductor

· Ti1 Si1 Os2

Ti1Si1Os2 is an experimental intermetallic compound combining titanium, silicon, and osmium—a research-stage material in the refractory metals family. While not yet commercially established, this composition represents exploration into high-performance ceramic-metallic hybrids with potential for extreme-environment applications where thermal stability and mechanical resilience are critical. The inclusion of osmium suggests investigation into materials for aerospace, high-temperature electronics, or wear-resistant coatings, though practical engineering use remains limited to specialized research and development contexts.

refractory coatingshigh-temperature electronicsaerospace researchwear resistanceadvanced composites development

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	272.5	GPa	—
Shear Modulus(G)	130.0	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.08170	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.5850	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ti1 Si1 Os2

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control