Ti1Pd2 is an intermetallic compound combining titanium and palladium in a 1:2 stoichiometric ratio, classified as a semiconductor material. This compound belongs to the family of metal intermetallics and represents an experimental or emerging material system with potential applications in thermoelectric devices, catalysis, and electronic components where the combination of metallic and semiconductive properties is advantageous. Ti-Pd intermetallics are noted for their potential in high-temperature applications and as catalytic materials due to palladium's catalytic activity combined with titanium's strength and thermal stability.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 24,309.9 | ksi | — | ||
Shear Modulus(G) | 7,783.7 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00840 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.6340 | eV/atom | — |