Ti₁P₁N₃ is a titanium phosphide nitride compound, a ternary semiconductor that combines metallic and covalent bonding characteristics. This material belongs to the family of transition metal pnictides and is primarily of research interest for its potential in high-temperature electronics, optoelectronics, and hard coating applications where conventional semiconductors reach thermal or chemical limits.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 27,394.4 | ksi | — | ||
Shear Modulus(G) | 10,646.8 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.04200 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.8690 | eV/atom | — |