Ti1 Ni1 Sb1

semiconductor

· Ti1 Ni1 Sb1

TiNiSb is an intermetallic compound combining titanium, nickel, and antimony in a 1:1:1 stoichiometric ratio, belonging to the class of ternary semiconducting intermetallics. This material is primarily investigated in research contexts for thermoelectric applications and advanced materials research, where its semiconducting properties and intermetallic structure make it relevant for exploring phonon scattering mechanisms and thermal-to-electrical energy conversion. The TiNiSb family is notable for its potential in waste heat recovery systems and solid-state cooling devices, though practical applications remain largely developmental compared to mature thermoelectric materials like bismuth telluride.

Thermoelectric devicesWaste heat recoveryIntermetallic researchSolid-state coolingEnergy conversionAdvanced materials development

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Bulk Modulus(K)	125.1	GPa	—
Shear Modulus(G)	53.40	GPa	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.02010	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.4830	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ti1 Ni1 Sb1

Mechanical Properties

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control