Ti1 Mn2 Al1
semiconductorTi₁Mn₂Al₁ is an intermetallic compound combining titanium, manganese, and aluminum—a research-phase material in the titanium-based alloy family with semiconductor properties. This composition represents an experimental effort to explore novel electronic and structural characteristics at the intersection of refractory metals and lightweight aluminum systems, with potential relevance to high-temperature electronic applications or advanced structural composites. The material remains primarily of academic interest and has not achieved significant commercial deployment, making it most relevant for researchers evaluating emerging intermetallic phases for next-generation aerospace, automotive, or solid-state device applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | — | ksi | — | — | |
Shear Modulus(G) | — | ksi | — | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | — | eV | — | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | — | eV/atom | — | — |