Ti1 In1 Au2
semiconductorTi₁In₁Au₂ is an intermetallic compound combining titanium, indium, and gold in a 1:1:2 stoichiometric ratio. This is a research-phase material rather than an established commercial alloy; such ternary intermetallics are typically investigated for their potential in electronic, photonic, or high-temperature applications where the combination of transition metal (Ti) and noble metals (Au, In) may offer unique electronic properties or thermal stability. The material family is notable in materials research for exploring how alloying titanium with gold and indium influences semiconductor behavior, potentially relevant to thermoelectric devices, optoelectronics, or specialized high-reliability electronics where Au provides corrosion resistance and thermal conductivity.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | — | ksi | — | — | |
Shear Modulus(G) | — | ksi | — | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | — | eV | — | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | — | eV/atom | — | — |