Ti₁Cu₂In₁ is an intermetallic compound combining titanium, copper, and indium in a 1:2:1 stoichiometric ratio. This material belongs to the family of ternary intermetallics and remains primarily in the research and development phase, with potential applications in thermoelectric devices, semiconducting components, and advanced functional materials where the combination of these three elements offers unique electronic or thermal properties.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.1140 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.1100 | eV/atom | — |