Ti1Au1 is an intermetallic compound combining titanium and gold in equiatomic proportions, belonging to the semiconductor class of materials. This compound represents an experimental or specialized research material rather than a widely commercialized alloy, likely studied for its unique electronic and mechanical properties arising from the Ti-Au system. The material's potential applications stem from the favorable properties of both constituent elements—titanium's biocompatibility and strength with gold's conductivity and corrosion resistance—making it of interest in specialized electronic, biomedical, or high-performance coating applications where conventional alloys are insufficient.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 141.5 | GPa | — | ||
Shear Modulus(G) | 20.96 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.02160 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.3390 | eV/atom | — |