Ti₁Al₁Pd₂ is an intermetallic compound combining titanium, aluminum, and palladium, classified as a semiconductor material. This composition sits at the intersection of titanium aluminide metallurgy and palladium-based intermetallics, making it primarily a research-phase material rather than an established commercial alloy. The palladium addition to conventional Ti-Al systems is investigated for potential applications requiring enhanced electronic properties, oxidation resistance, or catalytic functionality beyond what binary titanium aluminides provide.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 23,239.8 | ksi | — | ||
Shear Modulus(G) | 4,589 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.02770 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.7500 | eV/atom | — |