Ti₁Al₁Pd₂ is an intermetallic compound combining titanium, aluminum, and palladium, classified as a semiconductor material. This composition sits at the intersection of titanium aluminide metallurgy and palladium-based intermetallics, making it primarily a research-phase material rather than an established commercial alloy. The palladium addition to conventional Ti-Al systems is investigated for potential applications requiring enhanced electronic properties, oxidation resistance, or catalytic functionality beyond what binary titanium aluminides provide.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 23,239.8 | ksi | DFT · OptB88vdW | ||
Shear Modulus(G) | 4,589 | ksi | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.02770 | eV | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.7500 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data