Ti1 Al1 Os2

semiconductor

· Ti1 Al1 Os2

Ti1Al1Os2 is an intermetallic compound combining titanium, aluminum, and osmium—a research-phase material likely developed for high-temperature structural or functional applications where extreme hardness and thermal stability are critical. This compound belongs to the family of refractory intermetallics and represents an exploratory approach to improving upon conventional titanium aluminides by incorporating osmium's high density and strength. While not yet in widespread industrial production, materials in this compositional space are of interest to aerospace and materials researchers seeking alternatives to superalloys for ultra-demanding environments.

high-temperature aerospace structuresrefractory intermetallic researchwear-resistant coatingsadvanced propulsion systemsexperimental alloy development

Compliance & Regulations

?EAR?Conflict Free?RoHS?REACH?TSCA?Prop 65

Units:

si imperial

Property	Value	Unit	Conditions	Source
Band Gap(Eg)	0.05460	eV	—

Verified Unverified Low confidence (<80%) Link to source

Property	Value	Unit	Conditions	Source
Formation Energy(ΔHf)	-0.6240	eV/atom	—

Verified Unverified Low confidence (<80%) Link to source

Regulatory Screening

Environmental

Export Control

RoHS, REACH, and Prop 65 statuses are validated against official substance lists (ECHA SVHC Candidate List, OEHHA Prop 65, RoHS Annex II). Other regulations are estimated from composition and material classification. All screening is a starting point for due diligence — always verify with your supplier before making compliance decisions.

Ti1 Al1 Os2

Electrical Properties

Other Properties

Regulatory Screening

Environmental

Export Control