ThSiAu is a ternary intermetallic compound combining thorium, silicon, and gold—a research-phase material not yet established in mainstream industrial production. This material family represents an exploratory direction in high-density metallic systems, potentially relevant to specialized applications requiring the combined properties of thorium-based alloys with noble metal characteristics. The thorium-gold-silicon composition suggests investigation into applications demanding high density, thermal stability, or radiation resistance, though engineering adoption remains limited pending further characterization and process development.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 18,242.8 | ksi | — | ||
Poisson's Ratio(ν) | 0.2800 | - | — | ||
Shear Modulus(G) | 9,492.7 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.4071 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -9.310 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf) | -0.7646 | eV/atom | — |