Tantalum nitride (Ta₂N₁) is a refractory ceramic compound belonging to the transition metal nitride family, characterized by high hardness and thermal stability. It is employed in semiconductor device applications, thin-film barriers for copper interconnects in integrated circuits, and wear-resistant coatings, where its chemical inertness and mechanical strength provide advantages over conventional diffusion barriers and surface treatments. The material is of particular interest in advanced microelectronics and nanotechnology research for its potential to enable smaller feature sizes and improved device reliability.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 40,177.1 | ksi | — | ||
Shear Modulus(G) | 17,283.7 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.00900 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.8880 | eV/atom | — |