Ta1Cu1N2 is a ternary nitride compound combining tantalum, copper, and nitrogen, belonging to the family of transition metal nitrides with potential semiconductor or hard coating properties. This material is primarily of research interest rather than established industrial production, investigated for applications requiring the combined benefits of tantalum's refractory character and copper's conductivity in a nitride matrix. Its potential lies in advanced coatings, electronic devices, or wear-resistant applications where the unique phase chemistry might offer alternatives to conventional binary nitrides.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K) | 28,603 | ksi | — | ||
Shear Modulus(G) | 6,379.8 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.03990 | eV | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Formation Energy(ΔHf) | -0.4270 | eV/atom | — |