SnBi5 is an intermetallic compound combining tin and bismuth, belonging to the ceramic/intermetallic materials class. This material is primarily of research and development interest rather than a widespread industrial standard, and is studied for potential applications in thermal management, electronic packaging, and low-melting-point solder systems where bismuth-rich compositions offer benefits in wettability and reduced toxicity compared to traditional lead-based alternatives. Its notable characteristics stem from the intermetallic phases formed in the Sn-Bi binary system, making it relevant for lead-free electronics manufacturing and specialized joining applications where controlled melting behavior and density properties are critical.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.3309 | lb/in³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.02730 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.02733 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data