SnAu is a tin-gold intermetallic compound representing a binary metallic system with potential applications in electronics and materials research. This alloy combines tin's solderability and relatively low melting point with gold's corrosion resistance and reliability, making it relevant to the precious-metals alloy family. SnAu systems are primarily explored in microelectronics bonding, thermal interface materials, and interconnect research, where the tin-gold phase diagram offers opportunities to tailor properties for specific joining or conductivity requirements; however, adoption remains limited compared to conventional solders or bulk gold alloys due to cost considerations and the specialized nature of its applications.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)3 entries | 71.92 | GPa | — | ||
| ↳ | 71.92 | GPa | — | ||
| ↳ | 74.96 | GPa | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 1.027 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | Pa | — | ||
Poisson's Ratio(ν)2 entries | 0.3754 | - | — | ||
| ↳ | 0.3800 | - | — | ||
Shear Modulus(G)3 entries | 19.54 | GPa | — | ||
| ↳ | 19.54 | GPa | — | ||
| ↳ | 20.75 | GPa | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 10.97 | kg/m³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — | ||
Seebeck Coefficient(S) | -7.207 | µV/K | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.000 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -0.1596 | eV/atom | — | ||
| ↳ | -0.1739 | eV/atom | — |