SnAu5 is a tin-gold intermetallic compound representing a high-density metallic alloy system that combines tin and gold in a fixed stoichiometric ratio. This material is primarily of research and specialized industrial interest, used in applications requiring specific thermomechanical properties such as solder joint reliability, electronic interconnections, and microelectronic packaging where tin-gold systems offer superior performance over conventional solder materials. The tin-gold family is valued in high-reliability electronics for its resistance to thermal cycling fatigue and whisker mitigation compared to pure tin, making it relevant where extreme thermal cycling or miniaturized interconnects demand exceptional durability.
Compliance & Regulations
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Bulk Modulus(K)2 entries | 16,714.5 | ksi | — | ||
| ↳ | 16,591.7 | ksi | — | ||
Elastic Compliance Tensor(Sij) | Matrix (redacted) | 1/GPa | — | ||
Elastic Anisotropy(AU) | 0.4930 | - | — | ||
Elastic Stiffness Tensor(Cij) | Matrix (redacted) | ksi | — | ||
Poisson's Ratio(ν) | 0.4259 | - | — | ||
Shear Modulus(G)2 entries | 2,607.6 | ksi | — | ||
| ↳ | 2,653.1 | ksi | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 0.5834 | lb/in³ | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | — | ||
Magnetic Moment(μB) | 0.000 | µB | — |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.02250 | eV/atom | — | ||
Formation Energy(ΔHf)2 entries | -0.06010 | eV/atom | — | ||
| ↳ | -0.03546 | eV/atom | — |