Sn7Pb is a tin-lead alloy composition (7% lead, 93% tin nominal) traditionally used as a soft solder for electronic and mechanical applications. This material has been widely employed in electronics assembly, plumbing, and general-purpose joining for decades, though lead-containing solders are increasingly restricted in consumer electronics due to RoHS regulations in many markets. Engineers select tin-lead solders when eutectic or near-eutectic performance, lower processing temperatures, or compatibility with legacy systems justifies use; however, the shift toward lead-free alternatives (SAC alloys) has significantly reduced its application scope in new product development.
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| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Density(ρ) | 5.778 | kg/m³ | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Band Gap(Eg) | 0.000 | eV | DFT · OptB88vdW | ||
Magnetic Moment(μB) | 0.000 | µB | DFT · OptB88vdW |
| Property | Value | Unit | Conditions | Source | |
|---|---|---|---|---|---|
Energy Above Hull(ΔEhull) | 0.03680 | eV/atom | DFT · OptB88vdW | ||
Formation Energy(ΔHf) | 0.03682 | eV/atom | DFT · OptB88vdW |
Reference data from cited sources. Not verified or certified by MatWorld Inc. Verify against the source before use in design. Terms: engineering data